Nagase America provides next-generation thermal management for high-density data centers. We feature advanced graphene-based TIM pads, delivering exceptional thermal conductivity of 90W/mK+ and thermal resistance below 0.04. We also showcase high-performance coolants for DLC systems. Engineered for AI processors and high-power electronics, our materials ensure efficient heat dissipation for core components, power delivery systems, and VRMs. By preventing thermal throttling, we enhance component reliability as power densities escalate. Visit our booth to explore how our graphene technology and DLC solutions can solve your most complex thermal challenges and optimize infrastructure efficiency.
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